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Uniicon's June exhibition preview

2025-09-02 15:23:22 admin
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Unicon Technology Co., Ltd. will participate in or sponsor the following conferences in June. We welcome everyone to come and communicate.

2024.6.18-20

Changchun International Optoelectronic Expo

2024.6.25-26

Shiyin Lithography Materials Industry Conference

2024.6.26-28

Shenzhen International Semiconductor Exhibition



01 Changchun International Optoelectronic Expo



The 2024 Changchun International Optoelectronic Expo will be held at the Changchun Northeast Asia International Expo Center from June 18th to 20th, 2024. This exhibition takes "Optoelectronics Leadership, Co-creating the Future" as its theme and features exhibition displays, optoelectronics conferences and a series of activities. During this period, major conferences will be arranged, including the opening ceremony of the 2024 Changchun International Optoelectronic Expo and the Optoelectronic Industry Innovation and Development Conference, the 2024 Light International Conference, the Academic and Applied Research Conference in the Optoelectronic Field, and the second meeting of the Changchun Optoelectronic Information Industry Expert Committee. From the industry to the terminal, we will promote the smooth operation of the industrial chain and supply chain, continuously integrate and upgrade them, actively drive the high-quality supply of innovative technologies throughout the industry, and provide strong technological support for the high-quality development of China's economy.




1

Exhibition Information




Time2024.6.18-20

Location: Changchun Northeast Asia International Expo Center

Exhibition Hall: Optical Inspection and Metrology Exhibition Area

Booth: Hall A1, E15



2

Exhibition Overview




Unicon Technology Co., Ltd. will bring the F50 Film thickness gauge and Film Sense ellipsometer to the exhibition. We sincerely welcome everyone to come and discuss the related technologies at that time.

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02 Shiyin Lithography Materials Industry Conference



Photolithography materials, as key electronic chemical consumables for forming the fine circuits and structures of chips, come in a wide variety and have a huge demand in semiconductor manufacturing processes, involving photoresists, anti-reflective coatings, wet electronic chemicals for photolithography, photolithography gases, and so on. The conference will take "Innovation-driven - Building a New Ecosystem of an Independent and Controllable Photolithography Materials Industry Chain" as its theme, and deeply explore a variety of topics such as the research and development of cutting-edge photolithography materials technologies, the collaborative cooperation among industry, academia and research, market dynamics and future development trends.



1

Meeting information




Meeting Time: June 25-26, 2024

Meeting Venue: Holiday Inn Suzhou Huirong Plaza

Organizer: TrendBank

Co-organizer: International Joint Research Center for PhotoResponsive Functional Molecular Materials, Jiangnan University

Supporting units: China Electronic Gas Production and Utilization 100-Person Association, School of Chemistry and Materials Science, Jiangnan University, Chentao Capital, Future Industry Investment Alliance

Organizer: Shiyin Xinlian



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Meeting Agenda




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This event isClosed-door paid meeting



03 Shenzhen International Semiconductor Exhibition



The SEMl-e event is jointly organized by Shenzhen China New Materials Exhibition Co., LTD., the organizer, and the China Communications Industry Association, Jiangsu Semiconductor Industry Association, Zhejiang Semiconductor Industry Association, Shenzhen Semiconductor Industry Association, Dongguan Integrated Circuit Industry Association, and Chengdu Integrated Circuit Industry Association. SEMl-e will focus on various sub-sectors of the semiconductor industry, showcasing the semiconductor industry chain mainly including design, chips, wafer manufacturing and packaging, semiconductor-specific equipment and components, advanced materials, third-generation semiconductors/IGBTs, automotive semiconductors/automotive-grade advanced packaging technologies. It will comprehensively display the new technologies, new products, new highlights and new trends in the semiconductor industry. A new ecosystem for the exchange and integration of the semiconductor industry has been established.



1

Exhibition Information




TimeFrom June 26th to 28th, 2024

Location: Shenzhen International Convention and Exhibition Center

Unicon booth: 4D54



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